silicone thermal heatsink compounds grease paste, heat transfer thermally conductive manufacturer suppliers http://thermalcomounds.blog.com Tue, 26 Aug 2008 21:36:40 +0000 http://wordpress.org/?v=2.7 en hourly 1 fongyong Profile http://thermalcomounds.blog.com/2008/08/26/fongyong-profile/ http://thermalcomounds.blog.com/2008/08/26/fongyong-profile/#comments Tue, 26 Aug 2008 21:36:40 +0000 Doming resins

     Established in 1983, Fong Yong is a professional manufacturer of resins, who has devoted to the R&D of Resins for a long time. We regard our customers as treasures,and set our business objective as to offer the best quality of products and service to our customers, in order to satisfy all of the requirements of our customers.

     We get abundant experience on the manufacture of epoxy, silicones, acrylic and polyurethane . Our products encompass excellent weather resistance, good Chemicall stability, sate and user friendly. We also committed to develop product with better adhesion properties, higher mechanical strength, and better dielectric properties.As requested, we also offer customized products with specific colors to satisfy customer's needs.

     Our R&D Dept. not only concentrates on the development of new products, but also plays the main role of solving the specific needs of our customers as well. We are proud of our achievements that we have solved numerous of particular problems for our customers and got satisfied responses from them. Our experienced R&D team is ready to take any challenge to provide our best technical knowledge for customized product sand to satisfy customers' most stringent needs.

     We have a wide range of products which could not be listed thoroughly on this catalog.If the products you need do not be recorded here, or you are not satisfied with the products you are using, you have any problem on adhesion, sealant, coating and insulating etc , please do not hesitate to contact us. We would be more than happy to answer all your inquiries, and to respond your specific project requests.
　Silicone thermal heatsink compounds,thermal│ comounds│Silicone thermal grease│Heatsink grease │Heat transfer conductive │
 
 
-

Doming resins│doming chemical│Clear doming resins │Epoxy doming resins│

│Polyurethane doming resins│ PU doming resins│ Domed coating │

FONG YONG Chemical Co., Ltd.

2F. No 216-2, Chung Chang Rd, Su-Lin, Taipei Hsien, Taiwan, R.O.C.
TEL : 886-2-2682-4939    FAX : 886-2-2683-4333
E-Mail : fongyong@fongyong.com.tw
 
　│Potting compounds│epoxy potting compounds│Silicone potting compounds│Electronic potting and encapsulating compounds│Electrical and encapsulant potting compounds│ ]]>  

     Established in 1983, Fong Yong is a professional manufacturer of resins, who has devoted to the R&D of Resins for a long time. We regard our customers as treasures,and set our business objective as to offer the best quality of products and service to our customers, in order to satisfy all of the requirements of our customers.

     We get abundant experience on the manufacture of epoxy, silicones, acrylic and polyurethane . Our products encompass excellent weather resistance, good Chemicall stability, sate and user friendly. We also committed to develop product with better adhesion properties, higher mechanical strength, and better dielectric properties.As requested, we also offer customized products with specific colors to satisfy customer’s needs.

     Our R&D Dept. not only concentrates on the development of new products, but also plays the main role of solving the specific needs of our customers as well. We are proud of our achievements that we have solved numerous of particular problems for our customers and got satisfied responses from them. Our experienced R&D team is ready to take any challenge to provide our best technical knowledge for customized product sand to satisfy customers’ most stringent needs.

     We have a wide range of products which could not be listed thoroughly on this catalog.If the products you need do not be recorded here, or you are not satisfied with the products you are using, you have any problem on adhesion, sealant, coating and insulating etc , please do not hesitate to contact us. We would be more than happy to answer all your inquiries, and to respond your specific project requests.
　Silicone thermal heatsink compounds,thermal│ comounds│Silicone thermal grease│Heatsink grease │Heat transfer conductive │
 
 
-

Doming resins│doming chemical│Clear doming resins │Epoxy doming resins│

│Polyurethane doming resins│ PU doming resins│ Domed coating │

FONG YONG Chemical Co., Ltd.

2F. No 216-2, Chung Chang Rd, Su-Lin, Taipei Hsien, Taiwan, R.O.C.
TEL : 886-2-2682-4939    FAX : 886-2-2683-4333
E-Mail : fongyong@fongyong.com.tw
 
　│Potting compounds│epoxy potting compounds│Silicone potting compounds│Electronic potting and encapsulating compounds│Electrical and encapsulant potting compounds│
]]> http://thermalcomounds.blog.com/2008/08/26/fongyong-profile/feed/ fongyong products http://thermalcomounds.blog.com/2008/08/26/fongyong-products/ http://thermalcomounds.blog.com/2008/08/26/fongyong-products/#comments Tue, 26 Aug 2008 21:35:55 +0000 Doming resins


Features of Epoxy Resins
      1. Excellent insulation
          It can resist least 15 KV even at 1 mm thickness.
       2. Good adhesion properties
          Good adhesion properties to most materials.
       3. Good acidic and basic resistance
          Cured products exhibit good resistance in high level of acid and base solvents.
      4. Good protection of design secrete
          Cured products perform high-durometer, not easy to be destroyed.
       5. Reach UL levels
          Most products are UL approved.
 Silicone thermal heatsink compounds,thermal│ comounds│Silicone thermal grease│Heatsink grease │Heat transfer conductive │

Applications of Epoxy Resins
      1. Adhering and sealing.
      2. Potting and molding.
      3. Laminating.

One-Component Epoxy Resins

P/N Color CPS Features Applications
E-1200 Black paste 4,000 good fluidity, low temperature curable for small area potting of electric products
E-1202 Black paste 60,000 low temperature curable, good adhesion properties for adhesive and sealing of electric parts
E-1210 Black paste 35,000 good heat impact resistance for pottery clay material adhesive potting
E-1214 Black paste 60,000 good adhesive IC sealing
E-1215 Fluorescent red 600,000 fast cure, short term high temperature resistance (280 oC) SMT adhesive
E-1304 White paste 25,000 screen printable, good adhesive to glass LCD sealing
E-1385B Red thixtropic 150,000 fast cure short term high temperature resistance (280 oC) SMT adhesive, screen printing
E-1525 Black paste 120,000 non-sag, good heat resistance (180 oC) electronic devices adhesive

Silicone thermal heatsink compounds,thermal│ comounds│Silicone thermal grease│Heatsink grease │Heat transfer conductive │

Two-Component Epoxy Resins

P/N

Color

Mixing ratio

CPS

Features and Applications

E-0001/H-0001

Clear

3:1

1900/80

 low viscosity, high transparency, for metal surface encapsulating

E-110/H-101

Clear

3:1

11000/100

 imitated enamel, low viscosity, good for winter use

E-120B/H-100

Black

3:1

?

 high elongation strength, impact resistance, good adhesion to metals and plastics

E-126/H-2

Clear

2:1

?

 low viscosity, good adhesion to metals and plastics

E-190/H-190

Clear

100:40

2000/110

 good electrical properties, low reactive energy, suitable for large electronic parts potting

E-226/H-226

Light yellowish brown

2:1

- /4000

 long pot life, non-sag, good adhesion properties

E-226/H-816

Light yellowish brown

3:1

- /7000

 fast-curing, good adhesion properties

E-532A/H-532B

Black

100:15

3300/60

 UL94V0 approved, potting

E-536A/H-536B

Black

100:30

6000/180

 UL94V0 approved, high voltage resistant, high temperature resistant up to 170 oC

E-638/H-638

Black

100:30

45000/180

 high voltage resistance, high thermal conductivity, suitable for high volt ignition for motor-vehicles

E-721/H-721

Clear

1:1

1500/150

 good softness, for very tenuous lines potting and protection

E-759/H-759

Black

100:30

6000/150

 UL94V0 approved, soft potting, suitable for protection of tenuous lines

E-768/H-768

Clear

2:1

1000/500

 cold-resistance, good flexible, suitable for electronic parts potting

E-5600/H-5600

Variable colors

2:1

4000/300

 Easy handle, electronic & electrical components potting

Doming resins

│doming chemical│Clear doming resins │Epoxy doming resins│

│Polyurethane doming resins│ PU doming resins│ Domed coating │



 

│Potting compounds│epoxy potting compounds│Silicone potting compounds│Electronic potting and encapsulating compounds│Electrical and encapsulant potting compounds│

FONG YONG Chemical Co., Ltd.

2F. No 216-2, Chung Chang Rd, Su-Lin, Taipei Hsien, Taiwan, R.O.C.
TEL : 886-2-2682-4939    FAX : 886-2-2683-4333
E-Mail : fongyong@ms23.hinet.net

 Silicone thermal heatsink compounds,thermal│ comounds│Silicone thermal grease│Heatsink grease │Heat transfer conductive │ ]]>  

Features of Epoxy Resins
      1. Excellent insulation
          It can resist least 15 KV even at 1 mm thickness.
       2. Good adhesion properties
          Good adhesion properties to most materials.
       3. Good acidic and basic resistance
          Cured products exhibit good resistance in high level of acid and base solvents.
      4. Good protection of design secrete
          Cured products perform high-durometer, not easy to be destroyed.
       5. Reach UL levels
          Most products are UL approved.
 Silicone thermal heatsink compounds,thermal│ comounds│Silicone thermal grease│Heatsink grease │Heat transfer conductive │

Applications of Epoxy Resins
      1. Adhering and sealing.
      2. Potting and molding.
      3. Laminating.

One-Component Epoxy Resins

P/N Color CPS Features Applications
E-1200 Black paste 4,000 good fluidity, low temperature curable for small area potting of electric products
E-1202 Black paste 60,000 low temperature curable, good adhesion properties for adhesive and sealing of electric parts
E-1210 Black paste 35,000 good heat impact resistance for pottery clay material adhesive potting
E-1214 Black paste 60,000 good adhesive IC sealing
E-1215 Fluorescent red 600,000 fast cure, short term high temperature resistance (280 oC) SMT adhesive
E-1304 White paste 25,000 screen printable, good adhesive to glass LCD sealing
E-1385B Red thixtropic 150,000 fast cure short term high temperature resistance (280 oC) SMT adhesive, screen printing
E-1525 Black paste 120,000 non-sag, good heat resistance (180 oC) electronic devices adhesive

Silicone thermal heatsink compounds,thermal│ comounds│Silicone thermal grease│Heatsink grease │Heat transfer conductive │

Two-Component Epoxy Resins

P/N

Color

Mixing ratio

CPS

Features and Applications

E-0001/H-0001

Clear

3:1

1900/80

 low viscosity, high transparency, for metal surface encapsulating

E-110/H-101

Clear

3:1

11000/100

 imitated enamel, low viscosity, good for winter use

E-120B/H-100

Black

3:1

?

 high elongation strength, impact resistance, good adhesion to metals and plastics

E-126/H-2

Clear

2:1

?

 low viscosity, good adhesion to metals and plastics

E-190/H-190

Clear

100:40

2000/110

 good electrical properties, low reactive energy, suitable for large electronic parts potting

E-226/H-226

Light yellowish brown

2:1

- /4000

 long pot life, non-sag, good adhesion properties

E-226/H-816

Light yellowish brown

3:1

- /7000

 fast-curing, good adhesion properties

E-532A/H-532B

Black

100:15

3300/60

 UL94V0 approved, potting

E-536A/H-536B

Black

100:30

6000/180

 UL94V0 approved, high voltage resistant, high temperature resistant up to 170 oC

E-638/H-638

Black

100:30

45000/180

 high voltage resistance, high thermal conductivity, suitable for high volt ignition for motor-vehicles

E-721/H-721

Clear

1:1

1500/150

 good softness, for very tenuous lines potting and protection

E-759/H-759

Black

100:30

6000/150

 UL94V0 approved, soft potting, suitable for protection of tenuous lines

E-768/H-768

Clear

2:1

1000/500

 cold-resistance, good flexible, suitable for electronic parts potting

E-5600/H-5600

Variable colors

2:1

4000/300

 Easy handle, electronic & electrical components potting

Doming resins

│doming chemical│Clear doming resins │Epoxy doming resins│

│Polyurethane doming resins│ PU doming resins│ Domed coating │

 

│Potting compounds│epoxy potting compounds│Silicone potting compounds│Electronic potting and encapsulating compounds│Electrical and encapsulant potting compounds│

FONG YONG Chemical Co., Ltd.

2F. No 216-2, Chung Chang Rd, Su-Lin, Taipei Hsien, Taiwan, R.O.C.
TEL : 886-2-2682-4939    FAX : 886-2-2683-4333
E-Mail : fongyong@ms23.hinet.net
 Silicone thermal heatsink compounds,thermal│ comounds│Silicone thermal grease│Heatsink grease │Heat transfer conductive │
]]> http://thermalcomounds.blog.com/2008/08/26/fongyong-products/feed/ Epoxy potting http://thermalcomounds.blog.com/2008/08/26/epoxy-potting/ http://thermalcomounds.blog.com/2008/08/26/epoxy-potting/#comments Tue, 26 Aug 2008 21:35:03 +0000 Doming resins
0  Epoxy potting / encapsulating / casting / coating / sealant Compound series

Epoxy potting/encapsulating/coating/casting/sealant compounds
 

RTV (room temperature) / Heating epoxy compound, insulating materials for Electronic & Electrical components

Fong Yong 's RTV / Heating epoxy potting / encapsulating resin / compound be used widely in Electrical and Electronic Industry -> electronic / electrical potting and encapsulating coating --> epoxy compound, insulating materialss, encapsulating coatings, casting, threat sealant, high temperature sealants, industrial sealants, filling, insulating materials, thermal insulation, impregnating for most electronic components and electronic applications and insulation materials.

Hard type of two compound epoxy mold for resin pouring, encapsulating in clear/color resin

- Flexible type of two compound epoxy mold for resin pouring, encapsulating in clear/color resin

- diod led series of two compound epoxy mold for resin pouring, encapsulating in clear/color resin

- UL 94V0 series - epoxy formulated compound

- one compound - epoxy formulated compound

diod led series of two compound epoxy mold for resin pouring, encapsulating in clear/color resin

UL 94V0 series - epoxy, silicone formulated compound

Doming resins│doming chemical│Clear doming resins │Epoxy doming resins│

│Polyurethane doming resins│ PU doming resins│ Domed coating │

POTTING, ENCAPSULATING, SEALANT, SEALANTS, COATING, ELENTRONIC ELENTRICAL COMPONENTS, INSULATING MATERIALS electronic electrical components, coating, casting, two / one epoxy potting compound, RTV heat epoxy,insulating materials, threat sealant, industrial sealants, puring resin TWO PARTS RESIN ENCAPSULATING COMPOUNDS

Hard type of two parts epoxy mold for encapsulating potting compounds in clear/color resin

 

 

E-128B/H-128

BLACK

3:1

5000/60

Good weather resistance, high tensile strngth, very suitable for electrical & electronic insulating, potting & encapsulating

E-190B/H-190

Black

100:40

4400/100

good electrical properties, low reactive energy, suitable for large electronic parts potting

E-226/H-120

Red

100:40-50

Paste/1200

easy handle, nan-sag, suitable for large electronic components adhesive impregnating

E-890A/H-105

clear

2:1

2400/1500

good weather resistance, high gloss surface, suitable for electronic components casting or film coating

E-590B-1/H-590

Black

100:20

25000/110

good weather resistance and thmeral conductivty, suitable for electronic components insulating potting and encapsulating

E-759BH/H-759H

Black

100:30

75000/9500

good weather resistance, longer pot-life, good thermal conductivty, suitable for electronic parts potting, encapsulating, casting and sealant

E-5260B/H-5260

Black

100:80

600/100

high tensile strength, low viscosity, suitable for insulating, potting, encapsulating, cating

E-5600B/H-5600

Black

2:1

3000/600

good electrical properties, easy handle, high temperature resistance, suitable for electrical & electronic insulating, potting, encapsulating and casting

E-120/H-100

colors

3:1

2100/30

easy handle, low viscosity, general used.

E-769B/H-769

Black

4:1

paste/1200

higher viscosity, suitable for capacitor coating, water proof, insulating, film protect, COB coating

E-1009/H-1009

colors

3:1

paste/100

midle viscosity, high temperature resistance, high thermal conductivity, hating curing type, suitable for large electronic components casting

E-638/H-638

colors

100:28

paste/110

higher viscosity, high voltage resistance, high thermal conductivity, suitable for high volt ignition for motor-vehicles

E-566B/H-566

Black

3:1

4500/600

midle high voltage resistance, high thermal conductivity, l ow temperature resistance, suitable for high volt ignition for vehicles

E-311W/H-311

White

2:1

15000/12000

thermal compound, thermal conductivity : 0.4W/mk

　│Potting compounds│epoxy potting compounds│Silicone potting compounds│Electronic potting and encapsulating compounds│Electrical and encapsulant potting compounds│


Flexible of two parts epoxy mold for potting encapsulating compound in clear / color resin
E-185B/H-185B

BLACK

3:1

1050/40

easy handle, low viscosity, low elastic, suitable for delicate electrical and electronic components potting and encapsulating

E-721B/H-721

Black

1:1

900/200

high tensile strength, elastic, low viscosity, low stress, suitable for delicate electrical components potting, encapsulating and casting
E-768/H-768

Black/Blue

100:60

2800/100

good weather resistance, low temperature resistance, elastic, RTV cured, excellent electrical properties, suitable for electronic parts potting and encapsulating

E-7311B/H-7311

Black/Clear

100:30

4000/100

easy handle, good impact strength and low temperature resistance suitable for electrical & electronic insulating, potting, encapsulating
E-X2/H-X2

colors

2:1

6000/120

super flexible, good low temperature resistance and impact strength

E-806B/H-806

Black

100:25

20000/300

flexible type, suitable for delicate electrical components insulating, potting, encapsulating and casting, low temperature more than -30 degree C

　Silicone thermal heatsink compounds,thermal│ comounds│Silicone thermal grease│Heatsink grease │Heat transfer conductive │

one compound - epoxy formulated compound
E-1200

BLACK

4000

good fluidity, low temperature curable

for small area potting of electric products

E-1385B

Red thixtropic

150000

fast cure short term high temperature resistance (280 oC)

SMT adhesive, screen printing
EP-A

BLACK

40000-50000

curing for low temperature good adhesive

IC sealing or electronic components adhesives

EP-A-2

Black/Clear

70000

curing for low temperature good adhesives

IC sealing or electronic components adhesives
EP-10-C

Black

80000

curing for medial temperature, good adhesives

IC sealing or electronic components adhesives

home

cpu heat sink / thmeral compound
epoxy potting encapsulating compounds, insulating materials, sealants, coating
UL94V0 potting compound, insulating materials, sealants, coating
silicone potting/sealant/coating compounds
doming resin - polyurethane (urethane, PU), epoxy

polyurethane doming resin

crystal clear two parts epoxy doming -- hard (rigid) type system

crystal clear two parts epoxy doming -- soft (flexible) type system

crystal clear two parts epoxy doming -- non-sag type system

epoxy potting/ encapsulating/ coating/ sealant compounds

color systems

Machine information

Contact us


FONG YONG Chemical Co., Ltd.

2F. No 216-2, Chung Chang Rd, Su-Lin, Taipei Hsien, Taiwan, R.O.C.
TEL : 886-2-2682-4939    FAX : 886-2-2683-4333
E-Mail : fongyong@ms23.hinet.net

 

]]>
0  Epoxy potting / encapsulating / casting / coating / sealant Compound series

Epoxy potting/encapsulating/coating/casting/sealant compounds
 

RTV (room temperature) / Heating epoxy compound, insulating materials for Electronic & Electrical components


Fong Yong ’s RTV / Heating epoxy potting / encapsulating resin / compound be used widely in Electrical and Electronic Industry -> electronic / electrical potting and encapsulating coating –> epoxy compound, insulating materialss, encapsulating coatings, casting, threat sealant, high temperature sealants, industrial sealants, filling, insulating materials, thermal insulation, impregnating for most electronic components and electronic applications and insulation materials.

Hard type of two compound epoxy mold for resin pouring, encapsulating in clear/color resin

- Flexible type of two compound epoxy mold for resin pouring, encapsulating in clear/color resin

- diod led series of two compound epoxy mold for resin pouring, encapsulating in clear/color resin

- UL 94V0 series - epoxy formulated compound

- one compound - epoxy formulated compound

diod led series of two compound epoxy mold for resin pouring, encapsulating in clear/color resin

UL 94V0 series - epoxy, silicone formulated compound

Doming resins│doming chemical│Clear doming resins │Epoxy doming resins│

│Polyurethane doming resins│ PU doming resins│ Domed coating │

POTTING, ENCAPSULATING, SEALANT, SEALANTS, COATING, ELENTRONIC ELENTRICAL COMPONENTS, INSULATING MATERIALS electronic electrical components, coating, casting, two / one epoxy potting compound, RTV heat epoxy,insulating materials, threat sealant, industrial sealants, puring resin TWO PARTS RESIN ENCAPSULATING COMPOUNDS

Hard type of two parts epoxy mold for encapsulating potting compounds in clear/color resin

 

 

E-128B/H-128

BLACK

3:1

5000/60

Good weather resistance, high tensile strngth, very suitable for electrical & electronic insulating, potting & encapsulating

E-190B/H-190

Black

100:40

4400/100

good electrical properties, low reactive energy, suitable for large electronic parts potting

E-226/H-120

Red

100:40-50

Paste/1200

easy handle, nan-sag, suitable for large electronic components adhesive impregnating

E-890A/H-105

clear

2:1

2400/1500

good weather resistance, high gloss surface, suitable for electronic components casting or film coating

E-590B-1/H-590

Black

100:20

25000/110

good weather resistance and thmeral conductivty, suitable for electronic components insulating potting and encapsulating

E-759BH/H-759H

Black

100:30

75000/9500

good weather resistance, longer pot-life, good thermal conductivty, suitable for electronic parts potting, encapsulating, casting and sealant

E-5260B/H-5260

Black

100:80

600/100

high tensile strength, low viscosity, suitable for insulating, potting, encapsulating, cating

E-5600B/H-5600

Black

2:1

3000/600

good electrical properties, easy handle, high temperature resistance, suitable for electrical & electronic insulating, potting, encapsulating and casting

E-120/H-100

colors

3:1

2100/30

easy handle, low viscosity, general used.

E-769B/H-769

Black

4:1

paste/1200

higher viscosity, suitable for capacitor coating, water proof, insulating, film protect, COB coating

E-1009/H-1009

colors

3:1

paste/100

midle viscosity, high temperature resistance, high thermal conductivity, hating curing type, suitable for large electronic components casting

E-638/H-638

colors

100:28

paste/110

higher viscosity, high voltage resistance, high thermal conductivity, suitable for high volt ignition for motor-vehicles

E-566B/H-566

Black

3:1

4500/600

midle high voltage resistance, high thermal conductivity, l ow temperature resistance, suitable for high volt ignition for vehicles

E-311W/H-311

White

2:1

15000/12000

thermal compound, thermal conductivity : 0.4W/mk

　│Potting compounds│epoxy potting compounds│Silicone potting compounds│Electronic potting and encapsulating compounds│Electrical and encapsulant potting compounds│

Flexible of two parts epoxy mold for potting encapsulating compound in clear / color resin
E-185B/H-185B

BLACK

3:1

1050/40

easy handle, low viscosity, low elastic, suitable for delicate electrical and electronic components potting and encapsulating

E-721B/H-721

Black

1:1

900/200

high tensile strength, elastic, low viscosity, low stress, suitable for delicate electrical components potting, encapsulating and casting
E-768/H-768

Black/Blue

100:60

2800/100

good weather resistance, low temperature resistance, elastic, RTV cured, excellent electrical properties, suitable for electronic parts potting and encapsulating

E-7311B/H-7311

Black/Clear

100:30

4000/100

easy handle, good impact strength and low temperature resistance suitable for electrical & electronic insulating, potting, encapsulating
E-X2/H-X2

colors

2:1

6000/120

super flexible, good low temperature resistance and impact strength

E-806B/H-806

Black

100:25

20000/300

flexible type, suitable for delicate electrical components insulating, potting, encapsulating and casting, low temperature more than -30 degree C

　Silicone thermal heatsink compounds,thermal│ comounds│Silicone thermal grease│Heatsink grease │Heat transfer conductive │

one compound - epoxy formulated compound
E-1200

BLACK

4000

good fluidity, low temperature curable

for small area potting of electric products

E-1385B

Red thixtropic

150000

fast cure short term high temperature resistance (280 oC)

SMT adhesive, screen printing
EP-A

BLACK

40000-50000

curing for low temperature good adhesive

IC sealing or electronic components adhesives

EP-A-2

Black/Clear

70000

curing for low temperature good adhesives

IC sealing or electronic components adhesives
EP-10-C

Black

80000

curing for medial temperature, good adhesives

IC sealing or electronic components adhesives



home


cpu heat sink / thmeral compound

epoxy potting encapsulating compounds, insulating materials, sealants, coating

UL94V0 potting compound, insulating materials, sealants, coating

silicone potting/sealant/coating compounds

doming resin - polyurethane (urethane, PU), epoxy

polyurethane doming resin


crystal clear two parts epoxy doming — hard (rigid) type system


crystal clear two parts epoxy doming — soft (flexible) type system


crystal clear two parts epoxy doming — non-sag type system


epoxy potting/ encapsulating/ coating/ sealant compounds


color systems


Machine information


Contact us


FONG YONG Chemical Co., Ltd.

2F. No 216-2, Chung Chang Rd, Su-Lin, Taipei Hsien, Taiwan, R.O.C.
TEL : 886-2-2682-4939    FAX : 886-2-2683-4333
E-Mail : fongyong@ms23.hinet.net

 
]]> http://thermalcomounds.blog.com/2008/08/26/epoxy-potting/feed/